Specialty · Manufacturer partner
OmniMAT · Advanced Thermal Materials
Thermal nanomaterials for electronics, AI servers, and packaging.
About OmniMAT
OmniMAT engineers high-performance nanomaterials and heat dissipation solutions for the highest-power electronics on the market — from AI accelerators to next-gen semiconductor packaging.
Product range
Representative grades
A representative selection. Full grade lists and technical data sheets are provided on request.
| Grade | Chemistry | Key property | Typical use |
|---|---|---|---|
| OM-Graphene | Multilayer graphene | Ultra-high thermal conductivity | TIMs, heat spreaders |
| OM-BN | Boron nitride nanosheets | Electrically insulating, high k | Packaging, filler systems |
| OM-Composite | Engineered TIM composites | Low thermal resistance | AI server accelerators |
Packaging
Standard bag, drum, and IBC options. Contact us for pack sizes and pallet configurations.
Lead time
Stock items ship from US warehousing. Non-stock grades typically 6–10 weeks from order.
Documentation
TDS, SDS, and CoA available on request for all grades in this line.
Request a OmniMAT sample or quote
Tell us the grade, application, and volume — we'll respond with pricing, availability, and a technical contact within one business day.